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US Patent 9136293 Methods and apparatus for sensor module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
September 7, 2012
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Date of Patent
September 15, 2015
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Patent Application Number
13606289
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Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11996424 Controllable gap height for an image sensor package
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US Patent 11695093 Superlattice photodetector/light emitting diode
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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 11855064 Techniques for processing devices
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US Patent 11935907 Image sensor device
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9136293
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Patent Primary Examiner
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Tucker Wright
0

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