Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 13, 2015
0Patent Application Number
130222150
Date Filed
February 7, 2011
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.
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