US Patent 9160346 Area and power efficient clock generation

Die-to-die interconnect structures are leveraged to form the inductive component of an LC oscillator, thus yielding an LC tank distributed across multiple IC dies rather than lumped in a single die. By this arrangement, reliance on area/power-consuming on-chip inductors may be reduced or eliminated, and phase-aligned clocks may be extracted from the LC tank within each of the spanned IC dies, obviating multiple oscillator instances or complex phase alignment circuitry.