Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jen-Yuan Chang0
Chia-Ping Lai0
Date of Patent
December 26, 2023
0Patent Application Number
178155570
Date Filed
July 27, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor structure and a method for forming the semiconductor structure are disclosed. The method includes the following operations. A first integrated circuit component having a fuse structure is received. A second integrated circuit component having an inductor is received. The second integrated circuit component is bonded to the first integrated circuit component. The inductor is electrically connected to the fuse structure, wherein the inductor is electrically connected to a ground through the fuse structure.
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