Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 27, 2015
0Patent Application Number
141662740
Date Filed
January 28, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method and a semiconductor device are provided. The semiconductor device includes a partial via etched in a stacked structure and a trough above the partial via. The method includes performing thick wiring using selective etching while etching the partial via to an etch stop layer.
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