Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Uk-song Kang0
Nam-seog Kim0
Seong-jin Jang0
Woo-dong Lee0
Byung-sik Moon0
Dong-hyeon Jang0
Hoon Lee0
Jin-ho Kim0
Date of Patent
January 26, 2016
0Patent Application Number
142626930
Date Filed
April 25, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A three-dimensional (3D) semiconductor device may include a stack of chips, including a master chip and one or more slave chips. I/O connections of slave chips need not be connected to channels on a motherboard, and only electrode pads of a master chip may be connected to the channels. Only the master chip may provide a load to the channels. A through-substrate via (TSV) boundary may be set on a data input path, a data output path, an address/command path, and/or a clock path of a semiconductor device in which the same type of semiconductor chips are stacked.
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