US Patent 9266267 Method of manufacturing a sensor
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Patent abstract
A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.
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Patent Inventor Names
Andreas Doering0
Dietmar Huber0
Edmond De Volder0
Jakob Schillinger0
Lothar Biebricher0
Martin Watzlawik0
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US Patent 09266267 Method of manufacturing a sensor US Patent 9266267 Method of manufacturing a sensor
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Patent Number
092662670
Patent Number
92662670
Edits on 27 Sep, 2022
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Patent Jurisdiction
Patent Number
092662670
Date of Patent
February 23, 2016
0Patent Application Number
137807310
Date Filed
February 28, 2013
0Official Website
Patent Primary Examiner
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US Patent 09266267 Method of manufacturing a sensor
Infobox
Is a
Patent jurisdiction
Patent number
09266267
Date of patent
February 23, 2016
Patent application number
13780731
Date Filed
February 28, 2013
Patent primary examiner
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