Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Charles W. C. Lin0
Chia-Chung Wang0
Date of Patent
March 29, 2016
0Patent Application Number
145430370
Date Filed
November 17, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of making a semiconductor assembly is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The base carrier provides a platform for the chip-on-interposer subassembly attachment, whereas the interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer and an optional cover sheet or additional buildup circuitry can be provided on the chip.
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