US Patent 11804444 Semiconductor package including heat dissipation structure

A semiconductor package includes; a semiconductor chip including a top surface and an opposing bottom surface, a heat dissipation structure including a lower adhesive layer adhered to the top surface of the semiconductor chip, a heat dissipation layer disposed on the lower adhesive layer, and a conductive layer disposed on the heat dissipation layer, a core layer including a cavity and a lower surface, wherein a combination of the semiconductor chip and the heat dissipation structure is disposed within the cavity, and a bottom re-wiring layer including a bottom re-wiring line connected to the semiconductor chip.