US Patent 11804444 Semiconductor package including heat dissipation structure
Is a
Date Filed
September 1, 2020
Date of Patent
October 31, 2023
Patent Application Number
17008961
Patent Citations
Patent Inventor Names
Myungsam Kang
Yongjin Park
Seonho Lee
Youngchan Ko
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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