Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Lawrence Douglas Andrews, Jr.0
Marc E. Robinson0
Simon J. S. McElrea0
Date of Patent
April 5, 2016
0Patent Application Number
134561260
Date Filed
April 25, 2012
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.