US Patent 9305862 Support mounted electrically interconnected die assembly
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Patent abstract
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
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Patent Inventor Names
Lawrence Douglas Andrews, Jr.0
Marc E. Robinson0
Simon J. S. McElrea0
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US Patent 09305862 Support mounted electrically interconnected die assembly US Patent 9305862 Support mounted electrically interconnected die assembly
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Patent Number
093058620
Patent Number
93058620
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Official Website
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Patent Jurisdiction
Patent Number
093058620
Date of Patent
April 5, 2016
0Patent Application Number
134561260
Date Filed
April 25, 2012
0Official Website
Patent Primary Examiner
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US Patent 09305862 Support mounted electrically interconnected die assembly
Infobox
Is a
Patent jurisdiction
Patent number
09305862
Date of patent
April 5, 2016
Patent application number
13456126
Date Filed
April 25, 2012
Patent primary examiner
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