Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Richard F. Hill0
Jason L. Strader0
Date of Patent
May 3, 2016
Patent Application Number
14463196
Date Filed
August 19, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
A thermal interface material assembly generally includes a substrate and one or more pillars protruding outwardly away from the substrate. A thermally-conductive heat path is at least partially defined by the substrate and the one or more thermally-conductive pillars, whereby heat may be transferable along the thermally-conductive heat path from a heat source of an electronic device.
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