US Patent 9330998 Thermal interface material assemblies and related methods
Patent 9330998 was granted and assigned to Laird (company) on May, 2016 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 19, 2014
Date of Patent
May 3, 2016
Patent Applicant
Patent Application Number
14463196
Patent Citations Received
Patent Inventor Names
Richard F. Hill
0
Jason L. Strader
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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