Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 9337135 Pop joint through interposer

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
October 8, 2014
0
Date of Patent
May 10, 2016
0
Patent Application Number
14509815
0
Patent Citations Received
‌
US Patent 12015003 High density interconnection and wiring layers, package structures, and integration methods
0
‌
US Patent 11776913 Semiconductor package and a package-on-package including the same
Patent Inventor Names
Mirng-Ji Lii
0
Chien-Hsun Lee
0
Jiun Yi Wu
0
Yu-Min Liang
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
9337135
0
Patent Primary Examiner
‌
Alexander Oscar Williams
0

Find more entities like US Patent 9337135 Pop joint through interposer

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo