Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takashi Fujikawa0
Hung Chih Chen0
Paul D. Butterfield0
Shou-Sung Chang0
Date of Patent
June 7, 2016
0Patent Application Number
142138420
Date Filed
March 14, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
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