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US Patent 9368395 Self-aligned via and air gap

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 6, 2014
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Date of Patent
June 14, 2016
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Patent Application Number
14270660
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Patent Citations Received
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US Patent 12136553 Opening structure and forming method thereof, contact plug structure and forming method thereof
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US Patent 11676854 Selective ILD deposition for fully aligned via with airgap
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US Patent 11705366 Methods for controllable metal and barrier-liner recess
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US Patent 12132076 Capacitance structure and forming method thereof
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Patent Inventor Names
Andy Chih-Hung Wei
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Mark A. Zaleski
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9368395
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Patent Primary Examiner
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Peniel M Gumedzoe
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