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US Patent 9372206 Testing of semiconductor chips with microbumps

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
August 24, 2015
Date of Patent
June 21, 2016
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent Application Number
14833950
Patent Citations Received
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US Patent 12136619 Methods of manufacturing three-dimensional integrated circuit structures
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US Patent 12125794 Semiconductor device and manufacturing method of semiconductor device
0
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US Patent 12125819 Die on die bonding structure
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US Patent 12131986 Semiconductor package and manufacturing method thereof
0
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US Patent 12131965 Apparatus for detecting end point
0
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US Patent 12131974 Semiconductor package and method of manufacturing semiconductor package
0
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US Patent 12132024 Semiconductor package and method of manufacturing the same
0
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US Patent 12132247 Semiconductor package and manufacturing method thereof
0
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US Patent 12137566 Peripheral circuitry under array memory device and method of fabricating thereof
0
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US Patent 12136593 Electronic apparatus including antennas and directors
0
•••
Patent Inventor Names
Shin-Puu Jeng
0
Chen-Hua Yu
0
Hsien-Pin Hu
0
Shang-Yun Hou
0
Wei-Cheng Wu
0
Chao-Hsiang Yang
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9372206
Patent Primary Examiner
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Patrick Assouad

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