Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chun-Wei Chang0
Hung-Chang Hsieh0
Wang-Pen Mo0
Date of Patent
June 21, 2016
0Patent Application Number
137641550
Date Filed
February 11, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A film layer on a substrate of the wafer is patterned to form a first plurality of areas of the film layer and a second plurality of areas of the film layer. The first plurality of areas of the film layer is removed. The second plurality of areas of the film layer is kept on the substrate. A first portion of the film layer is kept on the substrate. A first edge of the first portion of the film layer is substantially near an edge of the wafer. The first portion of the film layer defines a boundary for the wafer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
