Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 9, 2016
Patent Application Number
14664057
Date Filed
March 20, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A chip package may include: a first die; a second die; an underfill disposed between and in physical contact with the first die and the second die; and one or more conductive elements encapsulated in the underfill and coupling the first die and the second die to each other.
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