US Patent 9412678 Structure and method for 3D IC package
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Patent abstract
A chip package may include: a first die; a second die; an underfill disposed between and in physical contact with the first die and the second die; and one or more conductive elements encapsulated in the underfill and coupling the first die and the second die to each other.
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US Patent 09412678 Structure and method for 3D IC package US Patent 9412678 Structure and method for 3D IC package
Infobox
Patent Number
0941267800
Patent Number
941267800
Edits on 1 Apr, 2023
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Patent Jurisdiction
Patent Number
094126780
Date of Patent
August 9, 2016
0Patent Application Number
146640570
Date Filed
March 20, 2015
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
094126780
Date of Patent
August 9, 2016
0Patent Application Number
146640570
Date Filed
March 20, 2015
0Official Website
Patent Primary Examiner
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US Patent 09412678 Structure and method for 3D IC package
Infobox
Is a
Patent jurisdiction
Patent number
09412678
Date of patent
August 9, 2016
Patent application number
14664057
Date Filed
March 20, 2015
Patent primary examiner
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