US Patent 9446467 Integrate rinse module in hybrid bonding platform
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Patent abstract
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
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US Patent 09446467 Integrate rinse module in hybrid bonding platform US Patent 9446467 Integrate rinse module in hybrid bonding platform
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Patent Number
0944646700
Patent Number
944646700
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Patent Jurisdiction
Patent Number
094464670
Date of Patent
September 20, 2016
0Patent Application Number
138889210
Date Filed
May 7, 2013
0Official Website
Patent Primary Examiner
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Infobox
Is a
Patent Jurisdiction
Patent Number
094464670
Date of Patent
September 20, 2016
0Patent Application Number
138889210
Date Filed
May 7, 2013
0Official Website
Patent Primary Examiner
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US Patent 09446467 Integrate rinse module in hybrid bonding platform
Infobox
Is a
Patent jurisdiction
Patent number
09446467
Date of patent
September 20, 2016
Patent application number
13888921
Date Filed
May 7, 2013
Patent primary examiner
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