Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Dien-Yeh Wu0
Paul F. Ma0
Anantha K. Subramani0
Annamalai Lakshmanan0
Guojun Liu0
Date of Patent
October 11, 2016
Patent Application Number
13742596
Date Filed
January 16, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods for depositing metal layers, and more specifically TaN layers, using CVD and ALD techniques are provided. In one or more embodiments, the method includes sequentially exposing a substrate to a metal precursor, or more specifically a tantalum precursor, followed by a high frequency plasma.
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