Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takamasa Takano0
Date of Patent
October 25, 2016
0Patent Application Number
134750560
Date Filed
May 18, 2012
0Patent Citations Received
0
0
Patent Primary Examiner
Patent abstract
A sensor device and a manufacturing method thereof are provided in which no resin seal is used when a sensor is packaged, a change in connection relation according to a change in specifications of the control IC and others is facilitated when a control IC is packaged together with the sensor and high reliability is kept. The sensor device of the present invention includes a substrate containing an organic material and being formed a wiring, a sensor arranged on the substrate and electrically connected to the wiring, and a package cap arranged on the substrate and containing an organic material and covering the sensor, and the inside of the package cap is hollow.
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