Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 13, 2016
Patent Application Number
14517751
Date Filed
October 17, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods and systems for determining one or more parameters of a wafer inspection process are provided. One method includes acquiring metrology data for a wafer generated by a wafer metrology system. The method also includes determining one or more parameters of a wafer inspection process for the wafer or another wafer based on the metrology data.
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