US Patent 9520333 Wafer level package and fabrication method thereof

A semiconductor device includes a semiconductor device includes an interposer having a first side and a second side opposite to the first side, wherein the interposer comprises a redistribution layer (RDL), and the RDL comprises a first passivation layer on the first side and a second passivation layer on the second side; at least one active chip mounted on the first passivation layer on the first side through a plurality of first bumps penetrating through the first passivation layer; a molding compound disposed on the first side, the molding compound covering the at least one active chip and a top surface of the first passivation layer; and a plurality of solder bumps mounted on the first passivation layer on the second side.