Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 13, 2016
Patent Application Number
14849395
Date Filed
September 9, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A die is packaged by flip-chip mounting the die with the active side facing a low loss substrate. A ground plane is coupled to the active side of the die by vias through the low loss substrate. The ground plane is positioned to concentrate high frequency electromagnetic fields in the low loss substrate. A tuning height can be adjusted to tune the center frequency of a circuit in the die.
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