Patent 9520356 was granted and assigned to Analog Devices on December, 2016 by the United States Patent and Trademark Office.
A die is packaged by flip-chip mounting the die with the active side facing a low loss substrate. A ground plane is coupled to the active side of the die by vias through the low loss substrate. The ground plane is positioned to concentrate high frequency electromagnetic fields in the low loss substrate. A tuning height can be adjusted to tune the center frequency of a circuit in the die.