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US Patent 9520482 Method of cutting metal gate

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
1
Date Filed
November 13, 2015
1
Date of Patent
December 13, 2016
1
Patent Application Number
14940841
1
Patent Citations Received
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US Patent 12136600 Grounded metal ring structure for through-silicon via
2
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US Patent 12132092 Backside vias in semiconductor device
3
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US Patent 12132112 Work function control in gate structures
4
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US Patent 12132050 Semiconductor structure cutting process and structures formed thereby
5
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US Patent 12132000 Semiconductor device structure and methods of forming the same
6
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US Patent 12132041 Semiconductor device
7
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US Patent 12132115 Semiconductor device structure with dielectric stressor
8
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US Patent 12132118 Semiconductor device having a multilayer source/drain region and methods of manufacture
9
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US Patent 12132091 Work function layers for transistor gate electrodes
10
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US Patent 12132100 Profile control in forming epitaxy regions for transistors
11
•••
Patent Inventor Names
Chia-Wei Su
1
Shih-Ting Hung
1
Wei-Hao Wu
1
Yi-Hsuan Hsiao
1
Chih-Hao Wang
1
Gloria Wu
1
Inez Fu
1
Kai-Chieh Yang
1
Po-Chin Chang
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
9520482
1
Patent Primary Examiner
‌
David S. Blum
1
Industry
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