Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 27, 2016
Patent Application Number
12956422
Date Filed
November 30, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
Three-dimensional patterning methods of a three-dimensional microstructure, such as a semiconductor wire array, are described, in conjunction with etching and/or deposition steps to pattern the three-dimensional microstructure.
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