US Patent 9564385 Package for a semiconductor device
Patent 9564385 was granted and assigned to DEERE & COMPANY on February, 2017 by the United States Patent and Trademark Office.
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A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the sealed metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A housing is adapted for housing the semiconductor switch module within the metallic enclosure. The housing comprises chamber for holding or circulating a coolant overlying the metallic base.
US Patent 09564385 Package for a semiconductor device US Patent 9564385 Package for a semiconductor device
US Patent 09564385 Package for a semiconductor device
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