Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 7, 2017
Patent Application Number
14135375
Date Filed
December 19, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods for depositing extremely low resistivity tungsten in semiconductor processing are disclosed herein. Methods involve annealing the substrate at various times during the tungsten deposition process to achieve uniform tungsten layers with substantially lower resistivity.
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