Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 11, 2017
Patent Application Number
14969730
Date Filed
December 15, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor chip includes a plurality of stacked conductive layers. The plurality of stacked conductive layers includes a first conductive layer, a second conductive layer, and a third conductive layer. The first conductive layer is disposed on a first side of the second conductive layer. The third conductive layer is disposed on a second side of the second conductive layer. The third conductive layer is disposed on a side of the second conductive layer. The second conductive layer has a thickness which is thicker than those of the first conductive layer and the third conductive layer.
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