US Patent 9620510 Stacked metal layers with different thicknesses

A semiconductor chip includes a plurality of stacked conductive layers. The plurality of stacked conductive layers includes a first conductive layer, a second conductive layer, and a third conductive layer. The first conductive layer is disposed on a first side of the second conductive layer. The third conductive layer is disposed on a second side of the second conductive layer. The third conductive layer is disposed on a side of the second conductive layer. The second conductive layer has a thickness which is thicker than those of the first conductive layer and the third conductive layer.