Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 2, 2017
Patent Application Number
14226966
Date Filed
March 27, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.
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