US Patent 9636782 Wafer debonding using mid-wavelength infrared radiation ablation
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Patent abstract
Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.
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US Patent 09636782 Wafer debonding using mid-wavelength infrared radiation ablation US Patent 9636782 Wafer debonding using mid-wavelength infrared radiation ablation
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Patent Number
0963678200
Patent Number
963678200
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Patent Jurisdiction
Patent Number
096367820
Date of Patent
May 2, 2017
0Patent Application Number
142269660
Date Filed
March 27, 2014
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
096367820
Date of Patent
May 2, 2017
0Patent Application Number
142269660
Date Filed
March 27, 2014
0Official Website
Patent Primary Examiner
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US Patent 09636782 Wafer debonding using mid-wavelength infrared radiation ablation
Infobox
Is a
Patent jurisdiction
Patent number
09636782
Date of patent
May 2, 2017
Patent application number
14226966
Date Filed
March 27, 2014
Patent primary examiner
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