Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Hua Yu0
Shih-Peng Tai0
Tang-Jung Chiu0
Wen-Chih Chiou0
Chi-Hsi Wu0
Hsiang-Fan Lee0
Date of Patent
May 16, 2017
0Patent Application Number
150534400
Date Filed
February 25, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A package includes a substrate, the substrate having a first side and a second side, the second side being opposite the first side, and a stack of dies on a first side of the substrate. The package further includes a probing pad on the first side of the substrate, the probing pad being electrically coupled to the stack of dies, and a contact pad on the second side of the substrate, the contact pad being electrically coupled to the stack of dies.
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