US Patent 9653427 Integrated circuit package with probe pad structure

A package includes a substrate, the substrate having a first side and a second side, the second side being opposite the first side, and a stack of dies on a first side of the substrate. The package further includes a probing pad on the first side of the substrate, the probing pad being electrically coupled to the stack of dies, and a contact pad on the second side of the substrate, the contact pad being electrically coupled to the stack of dies.