Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Christopher P. Hussell0
David Todd Emerson0
Joseph G. Clark0
Michael John Bergmann0
Date of Patent
May 16, 2017
0Patent Application Number
136083970
Date Filed
September 10, 2012
0Patent Citations Received
Patent Primary Examiner
0
Patent abstract
An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
