Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Da Cheng0
Chung-Shi Liu0
Hung-Jui Kuo0
Yu-Hsiang (James) Hu0
Date of Patent
May 23, 2017
0Patent Application Number
146900150
Date Filed
April 17, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method includes forming an adhesive layer over a carrier, forming a sacrificial layer over the adhesive layer, forming through-vias over the sacrificial layer, and placing a device die over the sacrificial layer. The Method further includes molding and planarizing the device die and the through-vias, de-bonding the carrier by removing the adhesive layer, and removing the sacrificial layer.
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