Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 30, 2017
Patent Application Number
14005575
Date Filed
March 21, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.
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