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US Patent 9664599 Laser microdissection method and laser microdissection device

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Patent Citations Received
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US Patent 11994664 Augmented reality laser capture microdissection machine
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Patent abstract

Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.

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US Patent 09664599 Laser microdissection method and laser microdissection device US Patent 9664599 Laser microdissection method and laser microdissection device

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Patent Number
0966459900
Patent Number
966459900
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=0966459900
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
096645990
Date of Patent
May 30, 2017
0
Patent Application Number
140055750
Date Filed
March 21, 2012
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=096645990
Patent Primary Examiner
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Geoffrey S. Evans
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edited on 28 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
096645990
Date of Patent
May 30, 2017
0
Patent Application Number
140055750
Date Filed
March 21, 2012
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=096645990
Patent Primary Examiner
‌
Geoffrey S. Evans
0
Edits on 15 Jun, 2022
"Entity importer update"
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=09664599
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 US Patent 09664599 Laser microdissection method and laser microdissection device

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
09664599
Date of patent
May 30, 2017
Patent application number
14005575
Date Filed
March 21, 2012
Patent primary examiner
‌
Geoffrey S. Evans

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