US Patent 9671141 Thermoelectric cooling packages and thermal management methods thereof
Patent 9671141 was granted and assigned to Samsung on June, 2017 by the United States Patent and Trademark Office.
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Patent abstract
A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.
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Patent Inventor Names
Eunseok Cho0
Jae Choon Kim0
Jichul Kim0
Jin-Kwon Bae0
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US Patent 09671141 Thermoelectric cooling packages and thermal management methods thereof US Patent 9671141 Thermoelectric cooling packages and thermal management methods thereof
Infobox
Patent Number
096711410
Patent Number
96711410
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
096711410
Date of Patent
June 6, 2017
0Patent Application Number
149611670
Date Filed
December 7, 2015
0Official Website
Patent Primary Examiner
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US Patent 09671141 Thermoelectric cooling packages and thermal management methods thereof
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09671141
Date of patent
June 6, 2017
Patent application number
14961167
Date Filed
December 7, 2015
Patent primary examiner
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