Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael B. Vincent0
Zhiwei Gong0
Scott M. Hayes0
Date of Patent
June 6, 2017
0Patent Application Number
145718780
Date Filed
December 16, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An encapsulated semiconductor device package with an overlying conductive EMI or RFI shield in contact with an end of a grounded conductive component at a lateral side of the package, and methods of making the semiconductor device package.
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