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US Patent 9673150 EMI/RFI shielding for semiconductor device packages
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Patent
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Date Filed
December 16, 2014
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Date of Patent
June 6, 2017
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Patent Application Number
14571878
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Patent Citations Received
US Patent 11764075 Package assembly for plating with selective molding
US Patent 11876003 Semiconductor package and packaging process for side-wall plating with a conductive film
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Patent Inventor Names
Michael B. Vincent
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Zhiwei Gong
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Scott M. Hayes
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9673150
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Patent Primary Examiner
Tod T Van Roy
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