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US Patent 9698104 Integrated electronic package and stacked assembly thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 14, 2016
Date of Patent
July 4, 2017
Patent Applicant
Freescale Semiconductor
Freescale Semiconductor
Patent Application Number
15182547
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
0
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US Patent 11927885 Fluoropolymer stamp fabrication method
0
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US Patent 11931855 Planarization methods for packaging substrates
0
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US Patent 11676832 Laser ablation system for package fabrication
0
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US Patent 11705365 Methods of micro-via formation for advanced packaging
0
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
0
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US Patent 11862546 Package core assembly and fabrication methods
0
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US Patent 11881447 Package core assembly and fabrication methods
0
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US Patent 11887934 Package structure and fabrication methods
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9698104
Patent Primary Examiner
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Dung Le

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