Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 11, 2017
Patent Application Number
13997596
Date Filed
December 23, 2011
Patent Citations Received
Patent Primary Examiner
Patent abstract
A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.
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