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US Patent 9716032 Via-free interconnect structure with self-aligned metal line interconnections

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
July 15, 2014
Date of Patent
July 25, 2017
Patent Application Number
14331272
Patent Citations Received
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US Patent 12125748 Contact plug
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US Patent 11658215 Method of forming contact structures
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US Patent 11916133 Self-aligned contact structures
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US Patent 11935783 Selective deposition for integrated circuit interconnect structures
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US Patent 11923311 Forming self-aligned multi-metal interconnects
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US Patent 11955535 Methods for forming air spacers in semiconductor devices
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US Patent 12009293 Barrier-free interconnect structure and manufacturing method thereof
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US Patent 12014987 Electro-migration reduction
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Patent Inventor Names
Shih-Ming Chang
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Ken-Hsien Hsieh
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Ru-Gun Liu
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Yu-Po Tang
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9716032
Patent Primary Examiner
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Brett Feeney

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