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US Patent 9721784 Ultra-conformal carbon film deposition

Patent 9721784 was granted and assigned to Applied Materials on August, 2017 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Applied Materials
Applied Materials
Date Filed
February 14, 2014
Date of Patent
August 1, 2017
Patent Applicant
Applied Materials
Applied Materials
Patent Application Number
14770412
Patent Citations Received
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US Patent 11676858 High bias deposition of high quality gapfill
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US Patent 12112949 Highly etch selective amorphous carbon film
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US Patent 12014927 Highly etch selective amorphous carbon film
0
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US Patent 11756961 Staggered stacked vertical crystalline semiconducting channels
Patent Inventor Names
Bok Hoen Kim
0
Shahid Shaikh
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Swayambhu P. Behera
0
Tersem Summan
0
Deenesh Padhi
0
Derek R. Witty
0
Heung Lak Park
0
Mandar B. Pandit
0
Patrick Reilly
0
Pramit Manna
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9721784
Patent Primary Examiner
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John C Ingham

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