Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Abhishek Singhal0
Jasmin Ajanovic0
Mahesh Wagh0
Date of Patent
August 15, 2017
0Patent Application Number
143101640
Date Filed
June 20, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.
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